1. 2. 3. material content data sheet sales product name bga 728l7 e6327 issued 30. january 2015 ma# MA000505226 package pg-tslp-7-1 weight* 1.62 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 0.147 9.12 9.12 91165 91165 leadframe non noble metal nickel 7440-02-0 0.329 20.34 20.34 203415 203415 wire noble metal gold 7440-57-5 0.043 2.69 2.69 26853 26853 encapsulation inorganic material antimonytrioxide 1309-64-4 0.000 0.03 294 organic material carbon black 1333-86-4 0.010 0.59 5886 plastics epoxy resin - 0.128 7.95 79455 inorganic material silicondioxide 60676-86-0 0.813 50.27 58.84 502921 588556 leadfinish noble metal gold 7440-57-5 0.032 1.96 1.96 19573 19573 plating noble metal gold 7440-57-5 0.032 1.96 1.96 19573 19573 glue plastics epoxy resin - 0.016 1.02 10173 noble metal silver 7440-22-4 0.066 4.07 5.09 40692 50865 *deviation < 10% sum in total: 100.00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. this product is in compliance with eu directive 2011/65/eu (rohs) and does not use any exemption. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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